| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer cleaning agent of simple composition, with which oily contaminant and inorganic contaminant can easily and efficiently be cleaned and which is superior in fire security and environmental protection. SOLUTION: Wafer cleaning agent consists of 5 to 25 wt.% of hydrocarbon of saturation or unsaturation with a flash point of 90 to 150°C, 5 to 65 wt.% of mono ether of glycol shown by R<SP>1</SP>-O-(-C<SB>p</SB>H<SB>2p</SB>-O-)<SB>q</SB>-H (in formula, R<SP>1</SP>- shows an alkyl group with the number of carbons of 6 to 10, (p) is number of 2 to 3, and (q) is number of 1 to 2), 5 to 30 wt.% of monoether of polyoxyalkylene shown by R<SP>2</SP>-O-(-R<SP>3</SP>-O-)<SB>r</SB>-H (in formula, R<SP>2</SP>- is an alkyl group with the number of carbons of 8 to 18 or an alkenyl group with the number of carbons of 8 to 18, -R<SP>3</SP>- is an alkyl group with the number of carbons of 2 to 3, and (r) is number of 4 to 20) and 5 to 25 wt.% of water. Kinematic viscosity at 40°C is not more than 10 mm<SP>2</SP>/S. COPYRIGHT: (C)2009,JPO&INPIT
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