| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power semiconductor module, a method for producing the power semiconductor module, and a semiconductor chip, which improve reliability in the connection of soldering portions of the power semiconductor module. <P>SOLUTION: In the power semiconductor module, a copper-containing first soldering partner, connection layers 214, 14, 114, and a copper-containing second soldering partner are arranged successively and fixedly connected with one another. The connection layer has a portion of intermetallic copper-tin phases of at least 90% by weight. For producing such a power semiconductor module the soldering partners and the solder arranged there between are pressed against one another with a predefined pressure and the solder is melted. After termination of a predefined period of time the diffused copper and the tin from the liquid solder form a connection layer comprising intermetallic copper-tin phases. The portion of the connection layer is at least 90% by weight of the connection layer created from the solder layer. <P>COPYRIGHT: (C)2009,JPO&INPIT |
