METHOD OF PRODUCING PRINTED WIRING BOARD AND MULTILAYER WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide inner conductor circuit treatment which is excellent in electrical properties and minimizes potential risks of unevenness and failures in wiring. SOLUTION: A method of producing a printed wiring board involving a process of forming an insulating layer on a core substrate on which a conductor circuit is formed and which is subjected to the inner conductor circuit treatment involving a process of forming a polyamide-imide layer as an adhesion promoting agent is provided. COPYRIGHT: (C)2009,JPO&INPIT