Microelectronic package, method of manufacturing same, and system including same

摘要

A microelectronic package includes a substrate ( 110 ) having a first die ( 120 ) and a second die ( 130 ) located thereon, a first thermal interface material ( 121 ) located over the first die, and a second thermal interface material ( 131 ) located over the second die. The first thermal interface material has a first set of characteristics, the second thermal interface material has a second set of characteristics, and the first set of characteristics is not identical to the second set of characteristics.