HEAT DISSIPATING SYSTEM FOR COMPUTER

摘要

A heat dissipating system is used for dissipating heat from a computer enclosure. The computer enclosure includes a front plate, a rear plate, and a side plate connected between the front and rear plates. First and second heat dissipating devices are accommodated in the enclosure. A motherboard is mounted on the side plate. A plurality of interface cards is mounted on the motherboard. The interface cards are located between the first and second heat dissipating devices.