| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To thin the plate thickness of a substrate to be cut and to facilitate thermal conduction to a table for holding the substrate to be cut, because a laser scribing process is materialized by imparting thermal change to the substrate to be cut and because it is undesirable that a balance changes between heat absorption into the substrate to be cut and heat radiation therefrom. <P>SOLUTION: On a table for sucking the substrate to be cut of the apparatus, there is provided a groove having a hole diameter or a traverse width equal to or less than twice the plate thickness of the substrate to be cut. Further, it is more desirable that the groove is equal to or less than the plate thickness or half or less than that. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
