| 摘要 |
PROBLEM TO BE SOLVED: To improve productivity as compared with a method using a dispenser, and to coat a compound ball having a small diameter with a very small amount of paste stably. SOLUTION: First, the compound ball 5 is fixed to all electrodes 4 for connecting each electronic device on a lower substrate 1 where a plurality of electronic devices are formed. Then, a print mask 6 having an opening 61 at the positions of all fixed compound balls 5 is arranged so that the upper parts of all compound balls 5 are brought into contact with each opening 61. Then, solder paste printing is performed, a recess is formed at a part in contact with the opening 61 of a surface layer 52 in the compound ball 5, and at the same time, solder paste 7 is stuck to the upper part of the compound ball 5. COPYRIGHT: (C)2009,JPO&INPIT
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