发明名称 Positive resist composition and pattern forming method
摘要 <p>A positive photosensitive composition comprises: (A) a resin that has an acid decomposable repeating unit represented by formula (I) and increases its solubility in an alkali developer by action of an acid: (B) a compound generating an acid upon irradiation with actinic light or radiation; (C) a hydrophobic resin insoluble in an alkali developer and having at least either one of a fluorine atom and a silicon atom; and (D) a solvent, wherein in the formula (I), Xa 1 represents a hydrogen atom, an alkyl group, a cyano group or a halogen atom, Ry 1 to Ry 3 each independently represents an alkyl group or a cycloalkyl group, and at least two of Ry 1 to Ry 3 may be coupled to form a ring structure, and Z represents a divalent linking group.</p>
申请公布号 EP1975716(A2) 申请公布日期 2008.10.01
申请号 EP20080006057 申请日期 2008.03.28
申请人 FUJIFILM CORPORATION 发明人 FUKUHARA, TOSHIAKI;KANNA, SHINICHI;KANDA, HIROMI
分类号 G03F7/039;G03F7/004;G03F7/075;G03F7/20 主分类号 G03F7/039
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