发明名称 CONDUCTIVE METAL PASTE AND METHOD FOR FORMING METAL FILM
摘要 A conductive metal paste is provided to decrease volume resistivity of metal film, and to reduce a production cost of the metal film. A conductive metal paste(30) comprises: metal particles which are dispersed as a conductive medium in a thermosetting resin composition; an organic solvent contained in the thermosetting resin composition; and a reductant which is contained in the thermosetting resin tissue, is an alcohol having a boiling point of 200 °C or below, has at least one reductive hydroxyl group in the molecule, and reduces the oxidized metal particles.
申请公布号 KR20080087696(A) 申请公布日期 2008.10.01
申请号 KR20080027139 申请日期 2008.03.25
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 SATO KATSUHIRO
分类号 H01B1/22;H01B1/00 主分类号 H01B1/22
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