发明名称 IMPROVED MICRO-WAVE MONOLITHIC INTEGRATED CIRCUIT WITH HEAT RADIATING ELECTRODE
摘要 A microwave monolithic integrated circuit comprising a GaAs substrate having upper and lower opposed surfaces, an active region and at least one passive region produced on the upper surface of the substrate, and a heat sink produced on the lower surface of the substrate, wherein the substrate thickness beneath the active region is smaller than the substrate thickness beneath at least one passive region, thereby disposing the heat sink near the active region to improve heat dissipation therefrom. The active region and the passive regions are separated by intermediate areas and the substrate thickness beneath the intermediate areas is smaller than the substrate thickness beneath the active region such that the heat sink at least partially surrounds the substrate beneath the active region. Each passive region is associated with a respective microwave transmission line having a predetermined width and a desired characteristic impedance and the thickness of the substrate beneath each of the passive regions is established individually based on the width and the desired characteristic impedance of each respective microwave transmission line.
申请公布号 GB2213638(B) 申请公布日期 1991.11.06
申请号 GB19880023335 申请日期 1988.10.05
申请人 * MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 MICHIHIRO * KOBIKI;MASAHIRO * YOSHIDA;TAKAHIDE * ISHIKAWA
分类号 H01L23/34;C03B29/06;C03B35/16;C03B35/18;F16C13/00;H01L21/822;H01L23/66;H01L27/04;H01L27/06 主分类号 H01L23/34
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