发明名称 IMPRITING STAMP FOR FORMING PATTERN AND METHOD OF FABRICATING LED PACKAGE USING THE SAME
摘要 <p>An imprinting stamp for a pattern formation and a method for manufacturing an LED(Light Emitting Diode) package using the same are provided to improve the light extraction efficiency of the LED package by forming a guard or barrier along a boundary of a groove section corresponding to LED package structures. LED package structures with LED chips are arranged on a co-plane by an imprinting method to configure an LED package set. A stamp is used for forming an unevenness pattern(310) on a surface of a resin package of the respective LED package structures. A groove section is prepared on a surface of the stamp corresponding to the LED package structure. A plurality of unevenness patterns are prepared in the stamp. A guard or barrier is formed along a boundary of the groove section corresponding to the respective LED package structures. The imprinting stamp is a soft stamp that is made of a polymer mater ial.</p>
申请公布号 KR20080087425(A) 申请公布日期 2008.10.01
申请号 KR20070029640 申请日期 2007.03.27
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 PARK, YOUN GON;LEE, JONG MYEON;WON, HYONG SIK
分类号 H01L33/54 主分类号 H01L33/54
代理机构 代理人
主权项
地址