| 摘要 |
A pressure sensor package (10) of the present invention includes: a pressure sensor (11) including at least a first conductive portion (17) having a space (13) inside a central region (±) on a surface of a semiconductor substrate, a thin-plate region above the space serving as a diaphragm section (14), and pressure sensitive elements (15) arranged in the diaphragm section, the first conductive portion being arranged on a peripheral region (²) excluding the diaphragm section on the surface and electrically connected to each of the pressure sensitive elements (15); and a first bump (18) arranged on the first conductive portion and electrically connected to it, wherein the thickness D1 of the semiconductor substrate at the peripheral region, the thickness D2 of the diaphragm section, the height D3 of the space, and the remaining thickness D4 of the semiconductor substrate excluding D2 and D3 at the central region satisfy the relationships: (D2+D3) << D4, and D1 being nearly equal to D4.
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