发明名称 MICROELECTROMECHANICAL DEVICE PACKAGING WITH AN ANCHORED CAP AND ITS MANUFACTURE
摘要 Integrated circuit (1) comprising a substrate (2), an active component (13) above the substrate (2), a cavity (14) surrounding partially the active component (13), a low dielectric region (15) surrounding partially the cavity (14) and a protective barrier (16) arranged around the low dielectric region (15).
申请公布号 KR20080085826(A) 申请公布日期 2008.09.24
申请号 KR20087004532 申请日期 2008.02.26
申请人 STMICROELECTRONICS (CROLLES 2) SAS;KONINKLIJKE PHILIPS ELECTRONICS N.V. 发明人 CHARBUILLET CLEMENT;GOSSET LAURENT
分类号 B81B7/00 主分类号 B81B7/00
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