INTEGRATED CIRCUIT CHIP AND MULTI-CHIP PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide an integrated circuit chip which can overcome the limit of chip size reduction.

SOLUTION: The integrated circuit chip 10 comprises a semiconductor substrate 11 having cell regions Acell1, Acell2and a perimeter region Aperi, a chip pad wiring pattern 12 formed on the semiconductor substrate 11, a protective film 16 covering the chip pad wiring pattern 12, and a rearrangement chip pad 17 formed on the cell regions Acell1, Acell2connected with the chip pad wiring pattern 12. Since the rearrangement chip pad 17 is formed above the cell regions Acell1, Acell2and a region for forming a chip pad is not provided in the perimeter region Aperi, the chip size can be reduced.

COPYRIGHT: (C)2008,JPO&INPIT