| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem wherein electrostatic protective elements occupy an area portion of approximately 10% and oppress an effective area, in some case, for a core semiconductor chip equipped with a CMOS integrated circuit, having many number signal lines and thereby having pads of many total number, since it is necessary to incorporate the electrostatic protective element also in each signal line pad and each power supply pad. <P>SOLUTION: Protecting a core semiconductor chip low in static electricity resistance from static electricity becomes possible, without making the chip area increase, by using an electrostatic protection chip. Furthermore, by employing a stacking structure, the ratio of a length of the electrostatic protection chip to the width of that can be reduced, in comparison with the case that the electrostatic protection chip, is arranged at the side of the core semiconductor chip, and invalid region accompanying dicing processing of the electrostatic protection chip can be reduced. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
