| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric module facilitating wiring work by forming a structure enabling connecting a lead extended from a package to a wiring pattern easily. SOLUTION: The thermoelectric module 10 comprises: an upper substrate 11, where an electrode pattern 11b for thermoelements is formed on the rear; a lower substrate 12, where an electrode pattern 12b for thermoelements is formed on the front; a plurality of thermoelements 13 arranged and fixed so that they are connected between the electrode patterns 11b, 12b for thermoelements in series; and a package rest 15 having a space section (cutout section) 15a arranged nearly at the center section on the upper substrate 11. A plurality of wiring patterns 11c for lead connection are formed on the surface of the upper substrate 11, and a plurality of leads extended from the package of an electron device unit arranged on the package rest 15 are joined to the wiring patterns 11c for lead connection. COPYRIGHT: (C)2008,JPO&INPIT |
