发明名称 COATED FILM FORMING DEVICE AND METHOD
摘要 PROBLEM TO BE SOLVED: To form a uniform treating liquid film by reducing the effect of a ripple generated in a pressure of a treating liquid fed from a treating liquid feed system and by suppressing the coating irregularity. SOLUTION: The device is provided with a nozzle 102 discharging the treating liquid R through a slit-shaped discharge opening while moving in parallel on a substrate G and coating the surface of the substrate G with the treating liquid R, a pump means 2 feeding the treating liquid R to the nozzle 102, a pressure detecting means 5 detecting the pressure of the treating liquid R fed by the pump means 2, an arithmetic means 7 forming an antiphase wave of a ripple frequency of a predetermined amplitude value or higher from the change of the pressure detected by the pressure detecting means 5 and outputting the antiphase wave at a predetermined timing, and a pressurizing means 9 applying the pressure based on the antiphase wave outputted by the arithmetic means 7 to the treating liquid R fed by the pump means 2. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008212861(A) 申请公布日期 2008.09.18
申请号 JP20070055303 申请日期 2007.03.06
申请人 TOKYO ELECTRON LTD 发明人 OTSUKA KEISUU;NAKAMITSU TAKASHI;KAWAGUCHI YOSHIHIRO
分类号 B05C5/02;B05C11/10;B05D1/26;B05D3/00 主分类号 B05C5/02
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