| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit module of which cooling of a heating component can be locally and efficiently performed to cope with larger currents, and mounting in higher density is realized. SOLUTION: The circuit module comprises a heatsink substrate in which a lead frame 1 and a metal plate 2 are integrated by molding a heat conductive resin 3 of such resin material as contains a heat conductive filler, a frame 7 where a recess is formed, and a heating component 4 mounted in the recess of the frame 7. The upper surface of the heating component 4 and one surface at an end part 7a of the frame 7 are flush with one surface of the heatsink substrate to be mounted. One surface of the end part 7a of the frame 7 is jointed to a part of the lead frame 1, and the upper surface of the heating component 5 is brought into face contact with one surface of the heatsink substrate. COPYRIGHT: (C)2008,JPO&INPIT |
