MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

Provided is a multilayer wiring board wherein heat dissipation characteristics are remarkably improved without sacrificing the mounting area even when the integration of electronic component is increased, and reliability is improved. A method for manufacturing such multilayer wiring board is also provided. A multilayer wiring board (10) is provided with a laminated body (11) wherein a plurality of ceramic layers (11A) are laminated, and a terminal electrode (13) formed on a side surface of the laminated body (11). Furthermore, the multilayer wiring board is provided with a heat dissipating via hole conductor (17) which penetrates the ceramic layers (11A) inside the laminated body (11), from the upper surface of the laminated body for connection with first, second and third electronic components (51, 52, 53) mounted on the laminated body (11); and a continuous via hole conductor (18), which is connected to the heat dissipating via hole conductor (17) and is formed by continuously arranging the via conductors in a planar direction within one ceramic layer (11A) to connect the heat dissipating via hole conductor (17) and the terminal electrode (13) in the laminated body (11).