| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To manufacture a semiconductor device with a high nondefective product rate by assuring the KGD (Known-Good-Die) of each semiconductor chip easily when composing a packaged semiconductor device by incorporating a plurality of semiconductor chips, and to utilize the position, pitch, signal array of the terminal of each semiconductor chip, and the like as they are without any restrictions. <P>SOLUTION: A projection provided on a semiconductor chip mount sealing subsubstrate 100 is bonded onto a package substrate 10. Semiconductor bare chips 31, 32 are arranged in the space formed between the semiconductor chip mount sealing subsubstrate 100 and the package substrate 10, for wiring. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
