| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure which has a large manufacturing margin when a resist member is formed after electronic components are mounted, and to provide an efficient manufacturing method of such a mounting structure. SOLUTION: In the mounting structure wherein the electronic components are mounted on a flexible wiring board, and in the manufacturing method thereof, when one surface of the flexible wiring board is a mounting surface and the other surface is a wiring surface, the mounting surface has mounting electric pads for mounting the electronic components thereon via holes having a bottom such as a blind via. One electronic component is mounted to the mounting electric pads using at least one pair of them as a unit, and two or more sets of paired mounting electric pads are provided, and a non-forming region of a resist member is provided astride at least one pair of mounting electric pads. COPYRIGHT: (C)2008,JPO&INPIT |
