| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor package wherein, even when stress acts between leads, the occurrence of resin crack is reduced, and heat dissipation of the heat generated from a semiconductor element is improved. <P>SOLUTION: A first lead 2 and a second lead 3 face each other with an interval 7. A semiconductor element 8 is mounted on the first lead 2. The second lead 3 and the semiconductor element 8 are connected by using a metal wire 5. The cross section shapes of the first and second leads 2 and 3 along a thickness direction T and parallel to a facing direction X have trapezoidal shapes formed in a direction engaging with each other. The first and second leads 2 and 3 have a pair of first inclined planes 2c and 3c facing each other with the interval 7. The first inclined plane 2c of the first lead 2 and the first inclined plane 3c of the second lead 3 incline in the same direction. First and second mounting surfaces 2b and 3b are exposed without covered with a resin package 4. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
