| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for processing a resist pattern and a method of processing a resist pattern which are adapted that can realize uniform and high-precision thinning of the line width of a resist pattern arranged on a substrate, using a low cost and easy technique. SOLUTION: The device for processing a resist pattern 1 is provided with a stage 12 for mounting a substrate 10 having a patterned photoresist R disposed on a surface; an ultraviolet irradiating section 14 for projecting an ultraviolet beam to the stage 12; and an annular member 16 that surrounds the entire periphery of the substrate 10. By doing so, the annular member 16 restrains ozone which is supplied in proximity to a mounting surface S for mounting the substrate10 on the stage 12, from diffusing to the periphery of the stage, thereby the ozone concentration in the surface of the substrate 10 mounted on the stage 12 becomes uniform. COPYRIGHT: (C)2008,JPO&INPIT |
