发明名称 SYSTEM FOR ATTACHING ELECTRONIC COMPONENTS TO MOLDED INTERCONNECTION DEVICES
摘要 A system for connecting electrical devices to one another is provided. This system includes a horizontal or non-horizontal substrate and an anchor connected to or formed integrally with the substrate. The anchor is either a raised structure or a recessed structure, and further includes at least one retention member formed integrally with the anchor. At least one electronic component is mounted within the anchor and the at least one retention member secures the component to the substrate. At least one electrical trace is disposed on the substrate and the at least one electrical trace extends into the anchor, contacts the at least one electronic component, and forms an electrical connection between the substrate and the at least one electronic component.
申请公布号 US2008222876(A1) 申请公布日期 2008.09.18
申请号 US20070684665 申请日期 2007.03.12
申请人 TYCO ELECTRONICS CORPORATION 发明人 WEBER RONALD M.;HORST SHELDON LYNN
分类号 H01L23/58;H01S4/00 主分类号 H01L23/58
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