发明名称 Lead free conductive composites for electrical interconnections
摘要 An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the metal represents at least about 30% by volume, based on the total volume of the composite. The composite is formed from the paste under elevated temperature. The paste is employed in processes which involve electrically connecting electrical and electronic components under process conditions which convert the paste to the composite.
申请公布号 US5866044(A) 申请公布日期 1999.02.02
申请号 US19960734492 申请日期 1996.10.21
申请人 INTERNATIONAL BUSINESS MACHINES 发明人 SARAF, RAVI F.;ROLDAN, JUDITH MARIE;GAYNES, MICHAEL ANTHONY;BOOTH, RICHARD BENTON;OSTRANDER, STEVEN PAUL;COOPER, EMANUEL I.;SAMBUCETTI, CARLOS J.
分类号 H01B1/22;H01L21/60;H01L23/498;H05K3/32;H05K3/46;(IPC1-7):H01B1/12 主分类号 H01B1/22
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