LASER WELDING MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a laser welding member with which laser welding can be performed with low power and low energy with reduced variation in welding and to provide a semiconductor device using the same.

SOLUTION: In the case of laser welding a lead frame 29 being copper and heat spreaders 17, 19 made of CuMo and CuW which are higher melting point materials than the copper, the laser welding is performs by forming an electrolytic Ni plating film 43 on the surface of the lead frame 29 and irradiating the electrolytic Ni plating film 43 surface with laser light and thereby, the laser welding can be performed with the low power and the low energy with the reduced variation.

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