| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin molding device which is so constructed that the neighborhood of the periphery and the center of a resin package can be simultaneously released from a mold and the amount of warpage of the resin package can be reduced. SOLUTION: The resin molding device has a lower mold 103 which forms the lower half part of the resin package 101 whose planar shape is rectangular, an upper mold 105 which forms the upper half part of the resin package 101, a mold support mechanism 106 which supports the lower mold 103 and the upper mold 105 so that they may have contacts or may be separated freely, a resin injection mechanism 107 which injects molten resin into a lower cavity 102 and an upper cavity 104, several eject pins 108 and 109 which are arranged on the lower cavity 102, a resin release mechanism 110 which projects and retracts the eject pins 108 and 109 toward and from the lower cavity 102. In this case, four eject pins 108 are arranged near the periphery of the planar shape of the resin package 101 and at least one eject pin 109 is arranged inside the four eject pins. COPYRIGHT: (C)2008,JPO&INPIT
|
