发明名称 COMPOSITION FOR FORMING INSULATION FILM
摘要 PROBLEM TO BE SOLVED: To provide a composition for forming an insulation film which is excellent in film properties such as permittivity and Young's modulus, capable of forming a film having a proper uniform thickness and suitable for using as an interlayer insulation film of semiconductor devices and the like. SOLUTION: The composition is formed by dissolving a cage type silsesquioxane compound in an organic solvent at a concentration of≤12 mass%, which silsesquioxane compound has two or more unsaturated groups as substituents, and polymerizing the compound by using a polymerization initiator, wherein the composition is characterized by containing a polymer provided by polymerizing≥70% of the compound and the polymerization initiator is preferably an azo compound. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008214454(A) 申请公布日期 2008.09.18
申请号 JP20070052632 申请日期 2007.03.02
申请人 FUJIFILM CORP 发明人 MORITA KENSUKE;MURAMATSU MAKOTO
分类号 C08L43/04;C08F230/08;H01L21/312;H01L21/768;H01L23/522 主分类号 C08L43/04
代理机构 代理人
主权项
地址