发明名称 |
Fibrous laminate interface for security coatings on an integrated circuit |
摘要 |
An integrated circuit (IC) package with a fibrous interface is provided. The package includes a substrate, a bond coat and a top coat. The substrate is configured to contain IC components and connections. The bond coat layer is configured to encapsulate the IC components. The top coat layer has at least a portion embedded in the bond coat layer. Moreover, the top coat layer includes a fibrous interface configured to provide security and strengthen the bond coat layer. |
申请公布号 |
EP1970954(A2) |
申请公布日期 |
2008.09.17 |
申请号 |
EP20080102418 |
申请日期 |
2008.03.07 |
申请人 |
HONEYWELL INTERNATIONAL INC. |
发明人 |
HEFFNER, KENNETH H.;DALZELL, WILLIAM J.;WARRENSFORD, KARA L. |
分类号 |
H01L23/29;H01L23/31;H01L23/58 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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