INTEGRATED ELECTRONIC DEVICE AND COOLING DEVICE FOR AN INTEGRATED ELECTRONIC DEVICE

摘要

The component has a printed circuit board (10) e.g. multilayer printed circuit board, and electronic power components (11) that are arranged on the board. A housing is provided for partially surrounding the board. The board has an inner layer (12), which is made of a heat conducting material e.g. solid copper. The power components are thermally connectable with the inner layer by a contact opening (13), which is arranged transverse to the board and designed as a drill hole. A clamping edge (16) is designed for thermally dissipating the heat from the inner layer. An independent claim is also included for a cooling device for an integrated electronic component.