| 摘要 |
A single wafer type apparatus for fabricating a semiconductor device is provided to perform smoothly a selective etching and cleaning process by moving an injection nozzle in front, rear, left, and right directions on a rear surface of a substrate. Three or more spin heads(202) are used for supporting a substrate(201). A spin head rotation driving unit(207) rotates one or more spin heads of the spin heads. A power transmission member transmits the rotation of the spin head drive unit to the spin heads. A spin head movement driving unit(208) moves the spin heads. An injection nozzle(209) injects chemicals onto the substrate. The spin heads, the spin head rotation driving unit, the spin head movement driving unit, and the injection nozzle are loaded on a substrate supporting unit(211). A substrate angle control unit controls an angle of the substrate.
|
