| 摘要 |
The present invention provides a flexible wiring substrate which does not form anomalous deposition of tin-bismuth alloy plating, through prevention of exfoliation, during the process of plating with tin-bismuth alloy, of a solder resist layer. The invention also provides a method for producing the flexible wiring substrate. The flexible wiring substrate 10 includes an insulating substrate 11 , a wiring pattern 12 formed on a surface of the insulating substrate 11 , and a solder resist layer 17 covering a surface of the wiring pattern 12 excluding at least terminal portions of the wiring pattern 12 , at least a portion of the outermost surface of the wiring pattern 12 which is not covered with the solder resist layer 17 being provided with a tin-bismuth alloy plating layer 26 , characterized in that the wiring pattern 12 comprises a base layer 21 formed of a conductor and that a first tin plating layer 24 is provided on the base layer 21 so as to extend under a region covered with the solder resist layer 17 and also under a region not covered with the solder resist layer 17.
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