| 摘要 |
In a metal gate replacement process, a gate electrode stack may be formed of a dielectric covered by a sacrificial metal layer covered by a polysilicon gate electrode. In subsequent processing of the source/drains, high temperature steps may be utilized. The sacrificial metal layer prevents reactions between the polysilicon gate electrode and the underlying high dielectric constant dielectric. As a result, adverse consequences of the reaction between the polysilicon and the high dielectric constant dielectric material can be reduced.
|
