| 摘要 |
An apparatus for performing a semiconductor process on a target substrate (W) includes a lifting mechanism ( 48 ) disposed in a worktable ( 38 ) to assist transfer of the target substrate. The lifting mechanism includes a lifter pin ( 51 ) configured to support and move up and down the target substrate, and a guide hole ( 49 ) configured to guide the lifter pin being moved up and down. The guide hole includes a main hole portion ( 49 a) which extends through the worktable from its upper surface to lower surface, and an extended hole portion ( 49 b) which extends into an extension sleeve ( 66 ) which projects downward from the lower surface of the worktable to correspond to the main hole portion.
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