| 摘要 |
A cluster-type semiconductor processing apparatus is provided to enable parallel treatment while using the increased number of wafer processing chambers by minimizing an increase of the width of a semiconductor fabricating apparatus even when the number of wafer processing chambers is increased. A cluster-type semiconductor processing apparatus includes a wafer handling chamber having a polygonal base. The polygonal base includes a plurality of lateral surfaces for wafer processing chambers and two adjacent lateral surfaces for loading/unloading wafers wherein the lateral surfaces are observed in the axial direction of the wafer handling chamber. The angle A between two adjacent surfaces of the plurality of lateral surfaces for the wafer processing chambers is greater than the angle B obtained by dividing 360 degrees by the total number of the plurality of lateral surfaces for the wafer processing chambers and the two adjacent lateral surfaces for loading/unloading the wafers.
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