Method for thermal process of SOI wafer,申请号KR20060138044-传众专利搜索

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发明名称	Method for thermal process of SOI wafer
摘要
申请公布号	KR100857386(B1)	申请公布日期	2008.09.05
申请号	KR20060138044	申请日期	2006.12.29
申请人		发明人
分类号	H01L21/20	主分类号	H01L21/20
代理机构		代理人
主权项
地址

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