ORGANIC INSULATING MATERIAL, VARNISH FOR ORGANIC INSULATING FILM USING THE SAME, ORGANIC INSULATING FILM AND SEMICONDUCTOR DEVICE

摘要

Disclosed is an organic insulating material having low dielectric constant, high heat resistance and high mechanical strength. Also disclosed are an organic insulating film obtained from the organic insulating material and having low dielectric constant, high heat resistance and high mechanical strength, and a semiconductor device comprising such an organic insulating film. Specifically disclosed is an organic insulating material containing a compound represented by the general formula (1) below, or a polymer obtained by polymerizing the compound represented by the general formula (1), or a mixture of the compound represented by the general formula (1) and the polymer. (In the formula (1), X and Y independently represent one or more groups having a polymerizable functional group; V and W each represents a group having an adamantane or polyamantane structure, and may be the same as or different from each other; and n represents 0 or an integer not less than 1.)