POLISHING DEVICE FOR SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a polishing device for a substrate for supporting a main spindle by a hydrostatic water bearing.

SOLUTION: This grinding device 1 for the substrate is provided with: a polishing plate P constituted by sticking an abrasive cloth 3a onto a surface of a rotary table supported by the hydrostatic water bearing; a work head W supported by the hydrostatic water bearing and provided with a substrate holder at a lower end of a work main shaft to enable linear motion/rotation of the work main shaft by linear motion/rotation composite actuator LM/RM; a fixation supporting plate S for fixing the work head in the vertical direction; a plurality of fixation supporting plate elevating mechanisms L for elevating and lowering the fixation supporting plate in the vertical direction; a kinematic coupling 80 constituted by attaching a male member 82 and a female member 81 of the kinematic coupling to a plunger 83 of an air cylinder in the fixation supporting plate elevating mechanisms and allowing the female member to receive the male member by vertical travel of the plunger and the male member to be separated from the female member; and a polishing liquid supply means.

COPYRIGHT: (C)2008,JPO&INPIT