| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder feeding method for selectively feeding solder as a joining material to an electrode pad of a printed wiring board, on which electronic components are mounted, and to provide a soldering material used in the solder feeding method. SOLUTION: The soldering material contains magnetic particles 1 and flux 2. The soldering material comprises a soldering-material essential constituent 3, which is made by coating the magnetic particles 1 with the flux 2 and then drying the coated material. COPYRIGHT: (C)2008,JPO&INPIT |
