| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleavage method capable of highly accurately performing load position control with a simple device. SOLUTION: A wafer 11 is made to adhere onto a support sheet 12. The support sheet 12 is an anisotropic sheet with different elastic modulus in X and Y directions. The support sheet 12 is constituted by arraying in one direction fibrous carbon wires or metallic wires or strip PET resin, etc., with comparatively high rigidity on a PVC (Polyvinyl Chloride), PET (Polyethylene Terephthalate) or acrylic resin with a thickness of about 70-300μm, and then, embedding the array with a resin tape. The wafer 11 with cut lines 11a formed therein is placed on the support sheet 12 and a load roller 15 is pressurized from the upper or lower part of the wafer 11. Thus, the wafer 11 is cleaved. COPYRIGHT: (C)2008,JPO&INPIT |
