发明名称 PLASMA ASSISTED VAPOR DEPOSITION SYSTEM AND PLASMA ASSISTED VAPOR DEPOSITION METHOD
摘要 PROBLEM TO BE SOLVED: To solve the problem that plasma can not be effectively generated except for the case where pressure is the one higher than the pressure with which the condition is made optimum in a vapor deposition process. SOLUTION: The plasma assisted vapor deposition system comprises: a waveguide allowing microwaves to propagate; a vacuum vessel introducing the microwaves from the waveguide; a dielectric substance clogging the outlet port of the waveguide and separating the space in the vacuum vessel from the space in the waveguide; a microwave horn antenna installed at the tip of the dielectric substance; a first gas pipe installed at the inside of the horn antenna through the side wall of the horn antenna and having a length to resonate with the microwaves; a mechanism introducing a gas from the gas introduction port at the tip of the fist gas pipe into the microwave horn antenna and generating plasma; an evaporation source installed in the vacuum vessel; and a second gas pipe installed between the evaporation source and a base material as the object for vapor deposition. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008202075(A) 申请公布日期 2008.09.04
申请号 JP20070037538 申请日期 2007.02.19
申请人 TOPPAN PRINTING CO LTD 发明人 ISHII RYOJI;NAKAJIMA TAKAYUKI;NAKAJIMA HIDEMI;SUEMOTO TAKUMI
分类号 C23C14/24 主分类号 C23C14/24
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