发明名称 MANUFACTURING METHOD OF ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of electronic equipment that can design and manufacture strictly EMC-compliant electronic equipment inexpensively and in a short period of time. SOLUTION: The manufacturing method of the electronic equipment (printed wiring board 20) having a noise suppression layer 10 of a thickness of 5 to 200 nm including a metallic material or conductive ceramics has the steps of: (a) designing the electronic equipment having the noise suppression layer; (b) performing an electromagnetic field analysis of the designed electronic equipment with the use of an electromagnetic field simulator to produce simulation results; (c) evaluating the EMC of the electronic equipment according to the simulation results to verify the design; and (d) manufacturing the electronic equipment according to the design verification results. In Step (b), complex permittivities and complex permeabilities of the noise suppression layer at a plurality of frequencies are input into the electromagnetic field simulator. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008204086(A) 申请公布日期 2008.09.04
申请号 JP20070038305 申请日期 2007.02.19
申请人 SHIN ETSU POLYMER CO LTD 发明人 KAWAGUCHI TOSHIYUKI;TAWARA KAZUTOKI;SAGA TSUTOMU;NEGISHI MITSUAKI
分类号 G06F17/50 主分类号 G06F17/50
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