Apparatus and Method for Separating and Transporting Substrates

摘要

The invention relates in particular to the separation and transportation of a disc shaped substrate ( 102; 202 ) such as e.g. a solar wafer. The invention is characterized by the fact that separations take place within a fluid, and that adhesion forces resulting from a thin fluid film develop between a gripper ( 108; 208 ) and the substrate to be separated ( 102; 202 ) that enable adherence to the gripper ( 108; 208 ). Through unloading perpendicular to the feed direction ( 105; 205 ) or particularly in parallel to the planar design of the substrates ( 102; 202 ), a very gentle and efficient separation of disc shaped substrates ( 102; 202 ) is possible with a short cycle time.