| 摘要 |
PROBLEM TO BE SOLVED: To provide a pattern forming method which prevents ink oozing or traveling to back side by screen printing with a stabilized printed shape, and also a method of manufacturing a semiconductor device using the pattern forming method. SOLUTION: In the pattern forming method and the method of manufacturing a semiconductor device having a source/drain electrode 12, a gate insulated film, an organic semiconductor layer, and a gate electrode laminated in this order on a substrate 11 using the pattern forming method; a liquid repellent layer A<SB>1</SB>is formed on the substrate 11 with a conductive film 12' disposed therebetween, and then a resist ink pattern R<SB>1</SB>' is printed by screen printing to form a resist pattern R<SB>1</SB>on the liquid repellent layer A<SB>1</SB>, and the conductive film 12' is etched with use of the resist pattern R<SB>1</SB>as a mask to form the source/drain electrode 12. COPYRIGHT: (C)2008,JPO&INPIT |
