SEMICONDUCTOR DEVICE AND DISPLAY ARRANGEMENT

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suppressing a higher impedance due to long distance of power source wiring within a flip-chip that employs multi-pin outputs, and the voltage drop at both ends in the major side direction within the flip-chip. SOLUTION: A relay electrode region 108 is disposed in the mid-way of a power source wiring 105 of a single layer wiring substrate 103 packaged with the flip-chip 101 and an upper heat dissipation plate 107 having electric conductivity and thermal conductivity is arranged in the upper part of the flip-chip 101. The upper heat dissipation plate 107 and the relay electrode region 108 are electrically connected via a member 111 for connection. Then, the power source potential from a connector section 106 or ground potential is supplied to a pump electrode of the flip-chip 101 via power source wiring 105 and is also supplied to a bump electrode near the end of the flip-chip 101 on a more distant side via the upper heat dissipation plate 107 when viewed from the connector section 106. COPYRIGHT: (C)2008,JPO&INPIT