| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate which has excellent adhesion between members, outstanding heat reliability and the capability of optionally modifying the surface of a support with a polymer layer and also, a laminate for manufacturing a printed wiring board featuring the excellent adhesion between members, heat reliability, electric characteristics and the easy moldability of a conducting layer. SOLUTION: This laminate comprises laminating a support, an intermediate layer which can generate an active species and a polymer layer composed of a graft polymer which is chemically joined together directly to the intermediate layer in the order and is characterized in that the support and the intermediate layer are a substantially identical material. In addition, the laminate for manufacturing the printed wiring board comprises laminating the intermediate layer which can generate the active species and the polymer layer made up of the graft polymer chemically joined together directly to the intermediate layer, in the order, on a printed wiring substrate or an interlayer insulating film is characterized in that the support and the intermediate layer are a substantially identical material. COPYRIGHT: (C)2008,JPO&INPIT
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