| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a liquid jetting head which can well form a high-density wiring pattern on a joining substrate with a penetration part. SOLUTION: The method for manufacturing includes a metal film formation process for forming a metal film 125 for wiring to be a wiring pattern via an insulating film to one surface of the joining substrate 30, a recessed part forming process for forming recessed parts 131 and 133 to be the penetration part by dry etching the joining substrate from the other surface side until it reaches the insulating film, a joining process for joining the joining substrate to a flow channel forming substrate 10, a removing process for removing by the dry etching the metal film for wiring of a region opposed to the recessed parts, and a patterning process for forming the penetration part by opening the recessed parts through removal of the insulating film of a region opposed to the recessed parts simultaneously when the wiring pattern 121 is formed by patterning by dry etching the metal film for wiring of the other regions. COPYRIGHT: (C)2008,JPO&INPIT
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