| 摘要 |
A semiconductor chip package including incorporated protection layers is provided to eliminate the necessity of an additional process for forming each protection layer by substantially simultaneously forming protection layers covering the surface of a semiconductor chip by a reflow process of a lamination film. A semiconductor chip(200) is formed on the front surface of a semiconductor package mounted on a printed circuit board(300). A back protection layer(245) protects the semiconductor chip from external surroundings, formed on the back surface of the semiconductor chip. A lateral protection layer(247) is formed on the lateral surface of the semiconductor chip. A front protection layer(249) fills a separation space between the front surface of the semiconductor chip and the printed circuit board. The back protection layer, the lateral protection layer and the front protection layer are incorporately formed of the same material. A polymer adhesion layer(242) can be formed between the back surface of the semiconductor chip and the back protection layer, accomplishing a chemical bond with the back surface of the semiconductor chip. |
