发明名称 WORKING PANEL FOR MULTILAYER CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a working panel for a multilayer circuit board that achieves product standardization and improves an yield by appropriately disposing first and second strips whose laminating positions are opposite each other in the center of a core and by locally spreading and canceling bending stress applied to the entire panel. SOLUTION: The working panel on which a plurality of strips comprising a number of circuit boards is arranged in a plane includes a first strip on which circuit layers having different circuit patterns are formed on upper and lower sides of the core, and a second strip on which circuit layers having different patterns are laminated on upper and lower sides of the core opposite to the circuit layer of the first strip. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008205434(A) 申请公布日期 2008.09.04
申请号 JP20070337460 申请日期 2007.12.27
申请人 SAMSUNG ELECTRO MECH CO LTD 发明人 LEE JAE JOON;KIM HAN;YOON IL SOUNG;CHO SEUNG HYUN
分类号 H05K3/46 主分类号 H05K3/46
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