发明名称 THERMOELECTRIC MODULE
摘要 PROBLEM TO BE SOLVED: To provide a thermoelectric module which can easily be modularized by use of a thermoelectric material of a thin film. SOLUTION: The thermoelectric module 1 is formed by laminating an N type thermoelectric thin film layer 3, an insulating thin film layer 5 and a P type thermoelectric thin film layer 7 successively, and also the N type thermoelectric thin film layer 3 is series-connected to the P type thermoelectric thin film layer 7 by an electrode thin film layer 9. In detail, the N type thermoelectric thin film layer 3, the insulating thin film layer 5, the P type thermoelectric thin film layer 7 and the electrode thin film layer 9 are conductive thin films manufactured by a vapor deposition process, and the N type thermoelectric thin film layer 3 is electrically connected to the P type thermoelectric thin film layer 7 by the electrode thin film layer 9 at a side end thereof. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008205181(A) 申请公布日期 2008.09.04
申请号 JP20070039476 申请日期 2007.02.20
申请人 NGK SPARK PLUG CO LTD 发明人 ITO TATSUNORI;UEKI MASAAKI;INOUE TAKAHARU
分类号 H01L35/32;H01L35/14;H01L35/34;H02N11/00 主分类号 H01L35/32
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